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MediaTek's next-generation flagship mobile processor, the Dimensity 9600, is expected to debut in the second half of 2026. (Pictured: Dimensity 9500 series.) (Photo by Wei Xinyang)

MediaTek Warns of 15% Global Smartphone Slump as AI Costs Bite

AI server manufacturers are entering peak shipping season ahead of schedule, with positive outlooks for foundries, advanced packaging, passive components, silicon wafers, CCL, ABF substrates, memory chips, and the broader AI supply chain. (Illustration /

Sell the News, Buy the Dip: Taiwan's AI Supercycle Isn't Over

TSMC announces global expansion of 3nm production. Pictured are 3nm process chips produced at Fab 18 in Southern Taiwan Science Park. (Photo by Ke Chenghui)

TSMC Ramps Up 3nm Production Worldwide to Meet Soaring AI Demand, Eyes A14 Chips by 2028

魏哲家獲亞洲大學頒授名譽博士(2) 台灣積體電路製造股份有限公司董事長魏哲家(圖)21日獲亞洲大學頒授名譽博士,在演講中分享人工智慧(AI)發展,更感謝提拔他的台積電創辦人張忠謀。(中央社)

TSMC's Wei on AI, Eldercare, and the Chip Behind It All

TSMC Chairman CC Wei (魏哲家) received an honorary doctorate from Asia University (亞洲大學), delivering a speech on artificial intelligence development and expressing gratitude to TSMC founder Morris Chang (張忠謀), who gave him his start. (CNA)

TSMC Chairman C.C. Wei Says Robot “Brains” Matter More Than Show