KAOHSIUNG, Sept. 29, 2026 /PRNewswire/ --
From Chip to Rack: Exploring Comprehensive Liquid Cooling Technologies for the AI Era
As AI computing continues to advance at an unprecedented pace, rising chip power densities and increasing thermal loads in data centers are creating new challenges for thermal management. Liquid cooling is rapidly becoming a critical technology for supporting the next generation of AI infrastructure.
At the 2026 OCP Global Summit, SUNON will showcase its latest liquid cooling innovations under the theme "Build to Chill." From chips and servers to rack level solutions, SUNON will present a comprehensive portfolio of liquid cooling solutions designed to address the evolving thermal demands of high performance AI computing.
From Chip to Rack: Building a Complete Liquid Cooling Ecosystem
At the event, SUNON will showcase liquid cooling technologies and solutions across multiple levels of the AI computing infrastructure:
- Chip Level
- Server Level
- Rack Level
By integrating thermal technologies across these different levels, SUNON aims to help customers address a wide range of power densities, operating environments, and system requirements with cooling solutions that deliver greater efficiency, reliability, and deployment flexibility.
Visitors to the 2026 OCP Global Summit are invited to visit the SUNON booth to explore our latest liquid cooling technologies and products, and to connect with the SUNON team to discuss the evolving thermal challenges and future trends shaping AI data centers.
Visit SUNON at Booth A19 and discover how we are building the next generation of cooling for AI.
【Exhibition Information】
- Event: OCP Global Summit 2026
- Date: October 12–15, 2026
- Venue: San Jose McEnery Convention Center, San Jose, California, USA
- SUNON Booth: A19 （Related： MagPro Launches AeroLev 1850 to Advance Water-Smart Cooling for AI Data Centers ｜ Latest ）
SUNON Focuses on High Performance AI Computing with Next Generation Liquid Cooling Solutions
