Taiwan-listed magnetic component makerLinkCom (聯寶) is accelerating its push into artificial intelligence (AI) infrastructure markets, positioning its transformer and power magnetics portfolio as essential hardware for next-generation data centers, silicon photonics, and low-earth-orbit (LEO) satellite ground terminals.
The company said silicon photonics power components and LEO satellite-related products are on track for small-volume shipments in the second half of this year, with Wi-Fi 8 products expected to scale into volume production in 2027.
"We are not just making transformers — we are building the power and signal stability hub of the AI era,"LinkCom President Julie Tan (譚明珠) said at a media briefing in Taipei on 23 March.
LinkCom's core product lines — LAN transformers and Power over Ethernet (PoE) transformers — already have an established customer base in networking equipment, General ManagerWilson Tan (譚偉傑) said. The transition to Wi-Fi 8 has prompted a fresh round of customer design-ins, he added.
The company said it has also entered the LEO satellite ground-terminal segment, noting that ground-side equipment offers a larger addressable market and broader applications than satellite hardware itself.
On silicon photonics,Wilson Tan said rising data transmission speeds — from 400G toward 800G and 1.6T — are making signal loss and power conversion efficiency critical bottlenecks.LinkCom is actively developing high-efficiency planar transformers for the 48V-to-12V power bricks required by silicon photonics modules, he said.
LinkCom's R&D advisor Lu Jin-shan (呂錦山) said current loads in AI systems can fluctuate sharply within extremely short intervals, placing far greater demands on power response speed, stability, and system integration than previous-generation applications. Power components, he said, have become a core capability that directly affects AI platform performance rather than a back-end support module. Lian Bao's long-accumulated foundation in magnetic component design, Lu added, is now the key asset underpinning its expansion into advanced power modules.
The company is also expanding into AI server and power-cabinet products. At APEC 2026,LinkCom showcased a 1.6kW, four-phase buck-architecture high-density matrix inductor, positioning itself to capture AI data center rack upgrade opportunities asthermal management and conversion efficiency become the next focus of competition.
Wilson Tan saidLinkCom differentiates itself through proprietary transformer structural design, EM simulation and validation, and high-wattage power product engineering capabilities developed in long-running partnerships with European and American IC design firms. Several major Taiwanese ODM manufacturers have approached the company since the second half of last year seeking to co-develop new power products for AI servers, he said, indicating that market demand is beginning to take tangible shape.
Beyond AI infrastructure, the company said it has been reorienting its wireless charging business over the past two years, shifting away from consumer-facing finished products toward B2B module markets, targeting smart furniture, wearables, fitness equipment, and medical devices — a shift aimed at reducing exposure to consumer electronics market cycles and improving its overall product mix and margin profile. Some fitness and medical application products are also expected to begin shipping in the second half of this year.
Original Article in Chinese
